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Stresses in bonded half-plates weakened by a circular hole

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National Technical University of Athens   

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Stresses in bonded half-plates weakened by a circular hole (EN)
Theotokoglou, EN (EN)
The problem is solved by the well established method of using a dislocation distribution on the perimeter of the hole to reduce it to a singular integral equation. Appropriate numerical techniques are applied and accurate evaluation of the stresses can be effected anywhere in the region of the bonded plates. As examples a constant uniaxial tension applied at infinity and an internal pressure within the hole are considered for selected material pairs. For these examples the stresses on the perimeter of the circular hole and on the interface are reported for a range of values for the geometric parameters of the problem. © 1990 Springer-Verlag. (EN)
journalArticle (EN)
Fracture Mechanics (EN)
Engineering, Multidisciplinary (EN)
Mathematical Techniques--Numerical Methods (EN)
Mechanics (EN)
Bonded Plates (EN)
Singular Integral Equation (EN)
Numerical Technique (EN)
Stresses--Analysis (EN)
Bonded Half-Plates (EN)
Plates (EN)
Dislocations (EN)
National Technical University of Athens
Digital Library of National Technical University of Athens | Dspace@NTUA
Κεντρική Βιβλιοθήκη Ε.Μ.Π.
Ιδρυματικό Αποθετήριο
Δημοσιεύσεις μελών Δ.Ε.Π. σε περιοδικά
Ingenieur-Archiv (EN)
English
1990 (EN)
http://hdl.handle.net/123456789/10205
0020-1154 (EN)
366 (EN)
6 (EN)
358 (EN)
10.1007/BF00542565 (EN)
60 (EN)
ISI:A1990DW18300002 (EN)
Springer-Verlag (EN)



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